Can heating be used to reduce the viscosity of epoxy resin?
Can heating be used to reduce the viscosity of epoxy resin? Yes, but there are some things you need to pay attention to.
In practical applications, the use of solvents to dilute epoxy resin adhesives, such as acetone or xylene, is the most common. Reducing resin viscosity through heating is also feasible, but the degree of reduction will have a certain range. Unlike using diluents, it can continuously reduce resin viscosity as the amount added increases.
One thing you need to pay attention to is that if you heat the epoxy resin adhesive compartment above room temperature, such as 50-60 ℃, do not directly add amine curing agents above room temperature. This will cause a rapid curing reaction of the resin adhesive, as shown in the following figure: the feeling of direct foaming.
For this situation, the final epoxy resin curing performance will be greatly affected. So, the heated epoxy resin adhesive needs to be naturally cooled to room temperature to be safe and reliable.
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